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SEMI Series
Solder Ball Placement System Chip Dust Removal System BGA Desoldering Rework System BGA Printing Press BGA Lead Free Reflow Oven CCGA Column Attachment System
PCBA Rework Series
BGA Rework System PCBA Desoldering Rework System PCBA Desoldering Glue Removal System PTH Rework System SMD Laser Rework System Chip Placement System Hot Air Desoldering System
Fully Automatic Printing Ball Placement System(on-line)

VT-560L

Fully Automatic Printing Ball Placement System(on-line)
Fully Automatic Wafer Ball Placement System(on-line)

VT-560LⅡ

Fully Automatic Wafer Ball Placement System(on-line)
Fully Automatic Ball Placement System(on-line)

VT-860A Series

Fully Automatic Ball Placement System(on-line)
Fully Automatic Laser Ball Placement System(on-line)

VT-870 Series

Fully Automatic Laser Ball Placement System(on-line)
Fully Automatic Printing Ball Placement System(off-line)

VT-860L Series

Fully Automatic Printing Ball Placement System(off-line)
Automatic Ball Placement System(off-line)

VT-860ML

Automatic Ball Placement System(off-line)
Solder Ball Placement System(off-line)

VT-860M

Solder Ball Placement System(off-line)
Chip Dust Removal System

VT-450

Chip Dust Removal System
BGA Desoldering Rework System

VT-660L

BGA Desoldering Rework System
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