01005 (metric 0402) is the current mainstream minimum standard for passive packaging in mass-produced consumer electronics, with dimensions of only 0.4mm x 0.2mm.
With core advantages such as high-density wiring, lightweight design, and high integration, 01005 serves as the foundational miniaturized component for high-end electronic products, including advanced semiconductor packaging, smart wearables, IoT devices, consumer electronics, and automotive precision modules.
However, their tiny size also presents key challenges for the SMT process, such as cold solder joints, tombstoning, and misalignment.
VTTECH has specialized in the field of fully automated micro-component rework, accumulating extensive industry experience. To address the pain points associated with 01005 micro-component rework, the company has launched the LCR laser rework system.
The LCR rework system is a fully automated rework solution that integrates automatic component removal, desoldering, solder/flux application, placement, and laser soldering. It is suitable for reworking surface-mount resistors, capacitors, MicroBGA, CSP, QFN, and other devices.
The entire system integrates automatic vision alignment, non-destructive component removal, automatic pad desoldering, vacuum pickup of micro-components, micrometer-level automatic placement, precision temperature-controlled soldering, and cooling inspection—all in a fully automated end-to-end process. It can be started with a single button and is specifically designed for ultra-micro components of various specifications, including 01005.
Key Advantages of the VTTECH LCR Laser Rework System
Automatic Image Positioning System
The imaging system automatically recognizes the information of SMD components and PCBA substrates, calculates coordinates and angle information, and attaches the components to the solder pad position.
Precision Motion Control System
High precision motion control system using gantry dual drive and full axis servo (accuracy±0.01mm).
Integrated Design of Removal and Tin Removal System
Intelligent BGA desoldering and separation; the removal head automatically positions the component; vacuum automatically removes the solder from the component and the pads; adaptive, non-contact desoldering ensures zero damage to the substrate pads.
Solder Paste/Flux Spraying System
Using a servo high-precision spraying system, according to the program settings, the solder paste or flux is automatically sprayed onto the solder pad.
Automatic mounting system
The mounting system automatically absorbs SMD components and attaches
Laser Welding System
Laser welding uses laser as the heat source. When the power density on the laser spot is sufficiently high (>106 W/cm2), the solder on the solder pad is rapidly heated under laser irradiation, and its surface temperature rises to the melting point of the solder in a very short time. The solder joint between the solder pad and the device forms a stable solder joint under the connection of the solder.
Modular Hot-Air Microcirculation Heating System
Regional heating module with independent temperature control help achieve better temperature uniformity.
PCBA Reference Temperature Detection System
Automatically start the tin removal or welding process according to the program settings, to ensure the consistency of the program use.
Hierarchical Authority Management & 4M Traceability
Avoid making arbitrary changes to parameter settings; barcode tracking and image archiving ensure full traceability throughout the process.