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On August 24, 2018, the world's first systematic seminar on PCBA rework was successfully held at VTTECH. With the rapid development of big data cloud services and smart electronic products, electronic products are evolving towards both larger and smaller sizes, placing higher demands on product performance and reliability, and posing greater challenges to production and reverse rework processes. In response to these issues, VTTECH provided videos of perfect solutions to each of the 13 major challenges in the PCBA rework industry, attracting widespread attention from the industry.

2018年是一个不平凡的一年，为提升中国制造水平，国家领导人提出了弘扬企业家精神和工匠精神，崴泰正是以此匠心精神做企业、做产品，自公司成立以来大力投入研发经费，自主研发了整套PCBA基板返修设备，解决PCBA行业难题。

MTK芯片由于较高的性价比,被广泛应用在众多手机设计中。在生产制造或对其作不良分析时,均需要对其进行返修重焊,但因其芯片设计上采用凹坑内植球焊锡的原因,人工除锡植球难度很大，成功率极低,造成大量产品报废。