Fully Automatic Laser Ball Placement System(on-line)

Fully Automatic Laser Ball Placement System(on-line)

Model: VT-870 Series
VT-870 series is a fully automatic equipment that directly heats solder balls through laser pulses, and sprays them directly onto the chip pads to solder them into balls after melting. It is suitable for ball planting or spotting of BGA, CSP, modules, substrates and other devices.
  • Automatic AOI detection, automatically determining extra ball, missing ball, bridge ball, and shift ball
  • Automatic identification Mark
  • The planting balls can be set arbitrarily, Arbitrary switching between on-line and off-line
  • AI Deep Learning
  • Supplementary ball