Fully Automatic Laser Ball Placement System(on-line)

Fully Automatic Laser Ball Placement System(on-line)

Model: VT-870
VT-870 is a fully automatic equipment that directly heats solder balls through laser pulses, and sprays them directly onto the chip pads to solder them into balls after melting. It is suitable for ball planting or spotting of BGA, CSP, modules, substrates and other devices.
  • Automatic AOI detection, automatically determining extra ball, missing ball, bridge ball, and shift ball
  • Automatically identify Mark
  • Free configuration of ball placement trajectory, Arbitrary switching between on-line and off-line
  • AI Deep Learning
  • Automatic ball refilling