- Automatic image positioning system, which automatically recognizes the information of SMD components and PCBA substrate, calculates coordinates and angle information, and attaches the components to the solder pad position
- High precision motion control system using gantry dual drive and full axis servo
- Integrated design removal and tin removal system, with automatic movement of the removal head and positioning device, and vacuum automatic removal of solder from the removed device and solder pad
- Solder paste/Flux spraying system, using a servo high-precision spraying system, automatically sprays solder paste or Flux onto the solder pad according to program settings
- Automatic mounting system, which automatically absorbs SMD components and attaches them to the programmed position
- The laser rework system uses a laser as the heat source. When the power density on the laser spot is large enough (>106 W/cm2), the solder on the solder pad is rapidly heated under laser irradiation, and its surface temperature rises to the melting point of the solder in a very short time. The solder joint between the solder pad and the device is connected by the solder, forming a stable solder joint
SMD Laser Rework System
Model: VT-360LXL/VT-360LML/VT-360LSL
SMD laser rework system is a fully automatic repair equipment that integrates automatic removal, tin removal, soldering/lux, mounting, and laser welding. It is suitable for the repair of chip resistors/capacitors, MicroBGA, CSP, QFN, and other devices.