- Automatically identify Mark points for alignment
- Automatically print solder paste
- Automatically attach columns
- Automatic AOl inspection to check for missing solder columns
- Support the MES system
CCGA Column Attachment System
Model: VT-850
VT-850 focuses on the attachment needs of core components in the micro-assembly field. It can carry out batch column attachment operations for micro-assembly power modules and large-scale integrated circuit devices. It is fully compatible with various types of products, including high-density integrated circuit module substrates, package-type devices, and CCGA packaged devices. By integrating automated processes such as solder paste printing, tooling attachment, and solder column attachment, it achieves efficient, precise, and standardized operation of core processes.