- Fully automatic and online
- Automatic image positioning system. The imaging system automatically grasps the mesh plate openings and wafer pads or mark images, and calculates and adapts their X, Y, Z θ Implement positioning
- Automatic flux&solder paste device: flexible setting of addition amount and frequency
- Automatic imaging inspection for defects such as tin connection, insufficient tin, and tin deviation
- Automatic ball adding device, ball low warning system
- AOI detection system with AI deep learning, automatically detecting extra ball, missing ball, bridge ball , and shift ball
Fully Automatic Wafer Ball Placement System(on-line)
Model: VT-560LⅡ
The wafer solder ball placement system VT-560LⅡ is a fully automatic machine that prints solder paste/Flux onto the wafer and then installs the solder ball onto the solder pad.