- Automatically generate program, professional software system automatically generates relevant data required for ball planting
- Printing system to realize automatic printing of FLUX or solder paste
- High-precision solder ball implantation system with an accuracy of 0.02mm
- Optical inspection system, professional optical image inspection system for inspection of implanted solder balls
- Fully automatic, according to the selected program, one-button operation, automatic printing and ball placement
- The machine comes with a vacuum ball collecting device, and a nitrogen device is reserved to prevent oxidation of the solder balls
- To be connected with MES system, easy 4M traceability
Fully Automatic Printing Ball Placement System(off-line)
Model: VT-860L Series
VT-860L series is a fully automatic BGA ball placement system, suitable for BGA, WLCSP, PoP and other types of BGA devices.