- Fully automatic one-button operation, easy to use
- Non-contact tin removal, zero damage to PAD
- Develop arbitrary temperature curves to meet different BGA device process requirements
- The unique desoldering method perfectly copes with the desoldering of special devices such as concave PoP, QFN, CSP, etc.
BGA Desoldering Rework System
Model: VT-660L
The VT-660L is a fully automatic non-contact tin remover that automatically removes tin solder from the solder pads of BGA, PoP, substrates, modules, and other devices.