- Fully automatic one-button operation is easy to use
- Non-contact desoldering with zero damage to the PAD
- Develop arbitrary temperature curves to meet different BGA device process requirements
- The unique desoldering method perfectly copes with the desoldering of special devices such as concave PoP, QFN, CSP, etc.
BGA Desoldering Rework System
Model: VT-660L
The VT-660L is a fully automatic non-contact desoldering that automatically removes tin solder from the solder pads of BGA, PoP, substrates, modules, and other devices.