- Three-part heating system design with independent temperature control.
- Modular design, ergonomic double-layer Table design
- High accuracy air flow control system provide air output automatically according to programming
- Program running records are automatically saved, program running records, and machine abnormal alarm prompts are saved, which is convenient for traceability and analysis
- Independent triple protection of heating system to ensure safe return for repair
- Data output is connected with MES to realize 4M traceability. Triple authority hierarchical management to prevent arbitrary modification of machine program settings
Automatic Alignment Series
Model: VT-360MⅢ
The VT-360MⅢ BGA repair bench is a modular design, fully automatic alignment, Dipping Flux or solder paste, and mounting repair machine with full hot air heating method,with high precision, high flexibility and other characteristics, suitable for servers, Netcom and other PCBA substrates. Repair of BGA, PTH, WLCSP, modules and other devices.