- Automatic Mark point recognition
- Features dual left and right workstations to improve production efficiency
- Platform heating function ensures better solder melting results
- High automation; fully automatic operation is achieved simply by manually placing the material tray
Fully Automatic Laser Ball Placement System(off-line)
Model: VT-870T
VT-870T is a fully automatic equipment that directly heats solder balls through laser pulses, and sprays them directly onto the chip pads to solder them into balls after melting. It is suitable for ball planting or spotting of BGA, CSP, modules, substrates and other devices.