Solder Ball Placement System

Laser Solder Ball Jetting System(on-line)

Model: VT-870A
The VT-870A employs a matrix laser spot system to heat solder balls post-balling, ensuring optimal soldering results. It is designed for the reflow soldering of BGA, CSP, modules, and substrates following the ball attachment process
  • Automatic Mark point recognition
  • Soldering paths can be freely defined, with seamless switching between online and offline modes