Automatic Ball Placement System(off-line)

Automatic Ball Placement System(off-line)

Model: VT-860ML
VT-860ML is a fully automatic ball planting machine that integrates tin ball implantation and AOI inspection, suitable for ball planting in BGA, WLCSP, substrate and other devices.
Product Features
  • High-precision solder ball implantation system with an accuracy of 0.02mm
  • Support one-mode multi-chip ball mounting
  • The machine comes with a vacuum ball collecting device, and a nitrogen device is reserved to prevent oxidation of the solder balls