- Unique mixed heating method of hot air microcirculation and thermal radiation
- Upper and lower heating modules, flexible debugging of any welding temperature curve
- Auto-Fully automatic; pallets automatically convey BGA
- Non-contact heating ensures uniform heat distribution across the BGA, preventing thermal shock
BGA Lead Free Reflow Oven
Model: VT-960SⅡ
The VT-960 series is a nitrogen back soldering oven mainly used for hot air heating and supplemented by thermal radiation, suitable for soldering after planting various types of BGA balls.