- Fully automatic and online
- Automatically generate ball placement program
- Broad spectrum, high flexibility, flexible and easy to use
- Modular design, flexible combination, to meet different processes
- Intelligent solder ball dynamic perception system, automatically completes filling of solder balls.
- AOI detection system with AI deep learning, automatically detecting extra ball, missing ball, bridge ball, and shift ball
- Automatic ball refilling
Fully Automatic Printing Ball Placement System(on-line)
Model: VT-560L
VT-560L is a fully automatic BGA ball placement system integrating printing and solder ball implantation. It is suitable for placing solder balls on various components such as BGA, WLCSP, PCB boards, etc.