- Fully automatic and online
- Scan to automatically launch the program
- Automatic imaging inspection for defects such as tin connection and insufficient tin
- Automatically inspect the quality of placement
- Fully automatic one-button operation, simple and easy to use, utilizing the MARK recognition algorithm to ensure error accuracy
- 4M comprehensive traceability, seamlessly integrated with MES
Chip Placement System
Model: VT-360PF
VT-360PF is a device that integrates Dipping Flux/solder paste and placement, suitable for various BGA devices.