- Fully automatic one-button operation, BGA removal, tin removal, dipping Flux/solder paste, placement, and soldering are automatically completed according to the program
- Three-part heating system design with independent temperature control, any combination; ergonomic double-layer table design, easy to deal with super-large PCBA substrates
- Excellent positioning system, quickly identify Mark points, and achieve accurate positioning of BGA removal, tin removal, solder paste dipping, and placement operations
- BGA desoldering removal system, automatically senses whether the BGA device is separated from the PCBA substrate
- Non-contact tin removal, the tin removal system automatically senses the amount of PCBA deformation, automatically adjusts the nozzle height according to the substrate deformation, and has zero damage to PCBA/PAD
- Precise air flow control system, automatically control the output according to the program
- Supports solder paste/flux paste printing of any thickness
- Modular hot air microcirculation heating system
- PCBA reference temperature detection system, automatically start the tin removal or welding process according to the program settings, to ensure the consistency of the program use
- Separation of management and operation authority to prevent arbitrary modification of parameter settings by humans
- Barcode management, BGA removal substrate pad traceability system, providing image data support for analysis and traceability
Fully Automatic VT-360A Series
Model: VT-360LA/VT-360SLA/VT-360SA/VT-360MSA
VT-360A series automatic BGA rework system is a modular design, full hot air heating, fully automatic rework machine, with high precision, high flexibility and other characteristics, suitable for servers, Netcom and other PCBA substrates. Repair of BGA, PTH, WLCSP, modules and other devices.